A3PE3000-2FG324I vs A3PE3000-2FGG324 Perbandingan

Perbandingan bersamaan detil A3PE3000-2FG324I dari Microchip Technology dan A3PE3000-2FGG324 dari Microchip Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Microchip Technology
A3PE3000-2FG324I A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I ✓ Aktif
Microchip Technology
A3PE3000-2FGG324 A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum A3PE3000-2FG324I A3PE3000-2FGG324
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Manufacturer Microchip Technology (Microsemi) —
Family ProASIC3E ProASIC3E
Logic Elements (LEs) 35000 LEs —
System Gates 3M gates 3000000
Maximum System Performance 310 MHz —
Process Technology 130 nm flash 130 nm CMOS flash
Core Supply Voltage 1.5 V 1.5 V
Number of I/Os 221 I/O —
Paket / Case 324-Ball FBGA —
Gaya Mounting SMD/SMT —
Operating Temperature (Min) -40 C —
Operating Temperature (Max) +85 C —
Speed Grade -2 2
Temperature Grade Industrial (I) —
Configuration Memory Non-volatile Flash (single chip) Flash (single-chip, instant-on)
Packaging Tray —
Product Series A3PE3000 —
Logic Cells — 75264
CLBs — 75264
Maximum System Frequency — 310 MHz
User I/O — 221
Total Memory Bits — [DATA_NEEDED: embedded SRAM capacity]
Paket — 324-ball FBGA (FGG324)
Package Dimensions — 19 x 19 mm, 1 mm pitch, 1.63 mm height
Tipe Mounting — Surface Mount
Suhu Kerja — [DATA_NEEDED: operating temperature range]
Packaging Type — Tray
Status RoHS — Green (RoHS compliant)
Automotive Qualification — Not qualified (standard grade)

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