A3PE3000-2FG324I vs A3PE3000-2FGG324 比較

詳細並排比較 A3PE3000-2FG324I 由 Microchip Technology 與 A3PE3000-2FGG324 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3PE3000-2FG324I A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I ✓ 啟用中
Microchip Technology
A3PE3000-2FGG324 A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 ✓ 啟用中

規格比較

參數 A3PE3000-2FG324I A3PE3000-2FGG324
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Manufacturer Microchip Technology (Microsemi) —
Family ProASIC3E ProASIC3E
Logic Elements (LEs) 35000 LEs —
System Gates 3M gates 3000000
Maximum System Performance 310 MHz —
Process Technology 130 nm flash 130 nm CMOS flash
Core Supply Voltage 1.5 V 1.5 V
Number of I/Os 221 I/O —
封裝 / 外殼 324-Ball FBGA —
安裝方式 SMD/SMT —
Operating Temperature (Min) -40 C —
Operating Temperature (Max) +85 C —
Speed Grade -2 2
Temperature Grade Industrial (I) —
Configuration Memory Non-volatile Flash (single chip) Flash (single-chip, instant-on)
Packaging Tray —
Product Series A3PE3000 —
Logic Cells — 75264
CLBs — 75264
Maximum System Frequency — 310 MHz
User I/O — 221
Total Memory Bits — [DATA_NEEDED: embedded SRAM capacity]
封裝 — 324-ball FBGA (FGG324)
Package Dimensions — 19 x 19 mm, 1 mm pitch, 1.63 mm height
安裝類型 — Surface Mount
工作溫度 — [DATA_NEEDED: operating temperature range]
Packaging Type — Tray
RoHS 狀態 — Green (RoHS compliant)
Automotive Qualification — Not qualified (standard grade)

資料表與資源

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