EP2A25B652C8 vs EP2A25F672C7N Perbandingan
Perbandingan bersamaan detil EP2A25B652C8 dari Altera dan EP2A25F672C7N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Altera
EP2A25B652C8 - Altera APEX II FPGA, 25K LE, BGA-652 | Intel FPGA
EP2A25B652C8 ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP2A25B652C8 | EP2A25F672C7N |
|---|---|---|
| Merek | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Series | APEX II | — |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | [DATA_NEEDED: exact LE count, ~16K-25K typical for EP2A25] | 24,320 cells |
| Maximum User I/O Pins | [DATA_NEEDED: per datasheet - approximate 380-420 for BGA-652] | — |
| Paket | BGA-652 (FineLine BGA) | — |
| Pin/Ball Count | 652 | — |
| Speed Grade | -8 | — |
| Suhu Kerja | 0C to +85C (Commercial) | 0 °C to 85 °C (commercial) |
| Process Technology | 0.15-micron CMOS | 0.15 µm all-layer copper (up to 8 metal layers) |
| Embedded Memory | Embedded System Blocks (ESBs) - dual-port RAM, ROM, CAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| PLLs | [DATA_NEEDED: number, typically 4 for APEX II] | Up to 4 |
| Hardware Multipliers | Yes (dedicated DSP blocks) | — |
| LVDS Support | Yes (multi-gigabit LVDS pairs) | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | — |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: per datasheet label, most APEX II BGA parts are lead-free but non-RoHS] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: per datasheet] | — |
| System Gates | — | Approximately 900,000 |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Logic Family | — | CMOS |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |