EP2A25B652C8 vs EP2A25F672C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25B652C8 sa pamamagitan ng Altera at EP2A25F672C7N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP2A25B652C8 - Altera APEX II FPGA, 25K LE, BGA-652 | Intel FPGA
EP2A25B652C8 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP2A25B652C8 | EP2A25F672C7N |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Series | APEX II | — |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | [DATA_NEEDED: exact LE count, ~16K-25K typical for EP2A25] | 24,320 cells |
| Maximum User I/O Pins | [DATA_NEEDED: per datasheet - approximate 380-420 for BGA-652] | — |
| Packhaging | BGA-652 (FineLine BGA) | — |
| Pin/Ball Count | 652 | — |
| Speed Grade | -8 | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0 °C to 85 °C (commercial) |
| Process Technology | 0.15-micron CMOS | 0.15 µm all-layer copper (up to 8 metal layers) |
| Embedded Memory | Embedded System Blocks (ESBs) - dual-port RAM, ROM, CAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| PLLs | [DATA_NEEDED: number, typically 4 for APEX II] | Up to 4 |
| Hardware Multipliers | Yes (dedicated DSP blocks) | — |
| LVDS Support | Yes (multi-gigabit LVDS pairs) | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | — |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: per datasheet label, most APEX II BGA parts are lead-free but non-RoHS] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: per datasheet] | — |
| System Gates | — | Approximately 900,000 |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Logic Family | — | CMOS |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |