EP2A25B652C8 vs EP2A25F672C7N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP2A25B652C8 tarafından Altera ve EP2A25F672C7N tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Altera
EP2A25B652C8 - Altera APEX II FPGA, 25K LE, BGA-652 | Intel FPGA
EP2A25B652C8 ⚠ Son Satın Alma
Özellik Karşılaştırması
| Parametre | EP2A25B652C8 | EP2A25F672C7N |
|---|---|---|
| Marka | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | Obsolete |
| Series | APEX II | — |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | [DATA_NEEDED: exact LE count, ~16K-25K typical for EP2A25] | 24,320 cells |
| Maximum User I/O Pins | [DATA_NEEDED: per datasheet - approximate 380-420 for BGA-652] | — |
| Paket | BGA-652 (FineLine BGA) | — |
| Pin/Ball Count | 652 | — |
| Speed Grade | -8 | — |
| İşletim Sıcaklığı | 0C to +85C (Commercial) | 0 °C to 85 °C (commercial) |
| Process Technology | 0.15-micron CMOS | 0.15 µm all-layer copper (up to 8 metal layers) |
| Embedded Memory | Embedded System Blocks (ESBs) - dual-port RAM, ROM, CAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| PLLs | [DATA_NEEDED: number, typically 4 for APEX II] | Up to 4 |
| Hardware Multipliers | Yes (dedicated DSP blocks) | — |
| LVDS Support | Yes (multi-gigabit LVDS pairs) | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | — |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| RoHS Durumu | [DATA_NEEDED: per datasheet label, most APEX II BGA parts are lead-free but non-RoHS] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: per datasheet] | — |
| System Gates | — | Approximately 900,000 |
| User I/Os | — | 492 |
| Propagation Delay (tPD) | — | 1.69 ns |
| Internal Operating Frequency | — | Up to 500 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| Logic Family | — | CMOS |
| Package Type | — | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| High-Speed I/O Support | — | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | — | Loadable PLD (in-system programmable) |