EP2A25F672C9 vs EP2A25F672C8N Perbandingan
Perbandingan bersamaan detil EP2A25F672C9 dari Altera dan EP2A25F672C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A25F672C9 | EP2A25F672C8N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (LE) | Approximately 25,000 | — |
| Macro Cells | 2432 | — |
| User I/O | 492 | — |
| Paket | 672-ball FCBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Package Dimensions | 27 mm x 27 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| Logic Family | CMOS | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| Suhu Kerja | 0°C to 85°C (Commercial) | 0 C to 85 C (commercial) |
| Tegangan Pemuat | [DATA_NEEDED: core VCC voltage] | — |
| I/O Standards | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) | — |
| Configuration | Passive Serial, Passive Parallel Synchronous, JTAG | — |
| Embedded Memory | ESBs for dual-port RAM, ROM, FIFO | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED] | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Core Supply Voltage | — | 1.5 V |
| Speed Grade | — | C8 |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |