EP2A25F672C9 vs EP2A25F672C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C9 sa pamamagitan ng Altera at EP2A25F672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C9 | EP2A25F672C8N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (LE) | Approximately 25,000 | — |
| Macro Cells | 2432 | — |
| User I/O | 492 | — |
| Packhaging | 672-ball FCBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Package Dimensions | 27 mm x 27 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| Logic Family | CMOS | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| Temperature na Operasyon | 0°C to 85°C (Commercial) | 0 C to 85 C (commercial) |
| Volte ng Pagbibigay | [DATA_NEEDED: core VCC voltage] | — |
| I/O Standards | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) | — |
| Configuration | Passive Serial, Passive Parallel Synchronous, JTAG | — |
| Embedded Memory | ESBs for dual-port RAM, ROM, FIFO | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED] | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Core Supply Voltage | — | 1.5 V |
| Speed Grade | — | C8 |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |