EP2A25F672C9 vs EP2A25F672C8N 比較
詳細並排比較 EP2A25F672C9 由 Altera 與 EP2A25F672C8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2A25F672C9 | EP2A25F672C8N |
|---|---|---|
| 品牌 | Altera | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (LE) | Approximately 25,000 | — |
| Macro Cells | 2432 | — |
| User I/O | 492 | — |
| 封裝 | 672-ball FCBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Package Dimensions | 27 mm x 27 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| Logic Family | CMOS | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| 工作溫度 | 0°C to 85°C (Commercial) | 0 C to 85 C (commercial) |
| 供應電壓 | [DATA_NEEDED: core VCC voltage] | — |
| I/O Standards | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) | — |
| Configuration | Passive Serial, Passive Parallel Synchronous, JTAG | — |
| Embedded Memory | ESBs for dual-port RAM, ROM, FIFO | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED] | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Core Supply Voltage | — | 1.5 V |
| Speed Grade | — | C8 |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |