EP2A25F672ES vs EP2A25F672C9 Perbandingan
Perbandingan bersamaan detil EP2A25F672ES dari Altera dan EP2A25F672C9 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A25F672ES | EP2A25F672C9 |
|---|---|---|
| Merek | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| Maximum Gates | 900,000 | — |
| Embedded System Blocks (ESBs) | 24 | — |
| Maximum Embedded RAM | 1.4 Mbit | — |
| Maximum User I/O Pins | 492 | — |
| Paket | 672-ball FC-FBGA | 672-ball FCBGA (FineLine BGA) |
| Process Technology | 0.15 µm CMOS | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V | — |
| Maximum System Clock Frequency | 500 MHz | — |
| Number of PLLs | 4 | — |
| I/O Banks | 16 | — |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, LVDS, LVPECL, HSTL | — |
| Configuration Mode | Serial / Parallel / JTAG | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Status RoHS | Compliant | [DATA_NEEDED] |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Logic Family | — | CMOS |
| Propagation Delay | — | 1.69 ns |
| Suhu Kerja | — | 0°C to 85°C (Commercial) |
| Tegangan Pemuat | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |
| Embedded Memory | — | ESBs for dual-port RAM, ROM, FIFO |
| Tipe Mounting | — | Surface Mount |