EP2A25F672ES vs EP2A25F672C9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672ES sa pamamagitan ng Altera at EP2A25F672C9 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672ES | EP2A25F672C9 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| Maximum Gates | 900,000 | — |
| Embedded System Blocks (ESBs) | 24 | — |
| Maximum Embedded RAM | 1.4 Mbit | — |
| Maximum User I/O Pins | 492 | — |
| Packhaging | 672-ball FC-FBGA | 672-ball FCBGA (FineLine BGA) |
| Process Technology | 0.15 µm CMOS | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V | — |
| Maximum System Clock Frequency | 500 MHz | — |
| Number of PLLs | 4 | — |
| I/O Banks | 16 | — |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, LVDS, LVPECL, HSTL | — |
| Configuration Mode | Serial / Parallel / JTAG | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED] |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Logic Family | — | CMOS |
| Propagation Delay | — | 1.69 ns |
| Temperature na Operasyon | — | 0°C to 85°C (Commercial) |
| Volte ng Pagbibigay | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |
| Embedded Memory | — | ESBs for dual-port RAM, ROM, FIFO |
| Uri ng Pagpapasok | — | Surface Mount |