EP2A25F672ES vs EP2A25F672C9 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672ES disebabkan oleh Altera dan EP2A25F672C9 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672ES | EP2A25F672C9 |
|---|---|---|
| Merek | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | — |
| Maximum Gates | 900,000 | — |
| Embedded System Blocks (ESBs) | 24 | — |
| Maximum Embedded RAM | 1.4 Mbit | — |
| Maximum User I/O Pins | 492 | — |
| Kemasan | 672-ball FC-FBGA | 672-ball FCBGA (FineLine BGA) |
| Process Technology | 0.15 µm CMOS | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V | — |
| Maximum System Clock Frequency | 500 MHz | — |
| Number of PLLs | 4 | — |
| I/O Banks | 16 | — |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, LVDS, LVPECL, HSTL | — |
| Configuration Mode | Serial / Parallel / JTAG | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Status RoHS | Compliant | [DATA_NEEDED] |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Logic Family | — | CMOS |
| Propagation Delay | — | 1.69 ns |
| Suhu Operasi | — | 0°C to 85°C (Commercial) |
| Tegangan Pemberi Arus | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |
| Embedded Memory | — | ESBs for dual-port RAM, ROM, FIFO |
| Jenis Pemasangan | — | Surface Mount |