EP2A25F672I6 vs EP2A25F672C8 Perbandingan
Perbandingan bersamaan detil EP2A25F672I6 dari Intel dan EP2A25F672C8 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2A25F672I6 | EP2A25F672C8 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | APEX II | APEX II (EP2A25) |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 microm CMOS, 8-layer copper interconnect |
| Paket | 672-ball FineLine BGA (FBGA-672) | 672-FBGA (FineLine BGA, 27x27 mm, 1.0 mm pitch) |
| Core Voltage | 1.5 V | — |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | C8 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | ESB blocks (dual-port RAM, FIFO, CAM, ROM) |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Non-compliant (legacy product) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 25,000 (typical gates) |
| Maximum System Gates | — | 40,960 |
| Macrocells / Embedded Logic | — | 2,432 macros |
| User I/O Count | — | 492 |
| Propagation Delay (tpd) | — | 1.69 ns |
| Suhu Kerja | — | 0 C to 85 C (commercial) |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL |
| LVDS Data Rate | — | 1 Gbps |
| PLL Count | — | 4 |
| I/O Banks | — | 16 |