EP2AGX45DF25I3G vs EP2AGX45CU17I3G Perbandingan
Perbandingan bersamaan detil EP2AGX45DF25I3G dari Intel dan EP2AGX45CU17I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX45DF25I3G | EP2AGX45CU17I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 42,959 | — |
| Adaptive Logic Modules (ALM) | 17,715 | — |
| Embedded Memory Bits | 3,517,440 bits | — |
| Embedded Memory M9K Blocks | [DATA_NEEDED: M9K block count] | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/O Pins | 252 | — |
| Transceiver Channels | [DATA_NEEDED: MGT channel count] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Paket | 572-ball FCBGA (HBGA) | 358-ball UBGA (FCBGA), 17x17 mm |
| Package Dimensions | 25 mm x 25 mm | — |
| Rentang Suhu Kerja | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| Hard IP for PCIe | PCIe Gen1/Gen2 endpoints and root ports | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | 3 | 3 (168 hours) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| User I/O Pins | — | 156 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Transceivers | — | Up to 8 channels |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Process Technology | — | 40 nm |
| Core Voltage (Vcc) | — | 1.0 V (0.9 V internal) |
| PLLs | — | 4 |
| DSP Blocks | — | Yes (variable-precision DSP) |
| Suhu Kerja | — | -40C to +100C (Industrial) |
| Ball Pitch | — | 1.0 mm |