EP2AGZ300FF35C3G vs EP2AGZ300FF35C4N Perbandingan

Perbandingan bersamaan detil EP2AGZ300FF35C3G dari Intel dan EP2AGZ300FF35C4N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2AGZ300FF35C3G EP2AGZ300FF35C4N
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Obsolete
Series Arria II GZ Arria II GZ
Logic Elements 300,000 298,000
Adaptive Logic Modules (ALMs) 119,088 —
Embedded Memory 17,133 Kbit —
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes [DATA_NEEDED: number of DSP blocks]
Transceivers 16 channels, up to 6.375 Gbps Multi-gigabit transceivers integrated
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) —
User I/Os 1,288 —
I/O Banks 12 —
Process Technology 40 nm TSMC 40 nm
Paket FCBGA-1152 (35 mm) —
Package Family BGA (Flip-Chip) —
Temperature Grade Commercial (0 C to 85 C junction) —
Speed Grade 3 (mid-performance) —
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel —
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ —
Status RoHS Compliant Compliant (per Besenchips / DigiKey listing)
Logic Array Blocks (LABs) — 11,920
Embedded Memory (bits) — 18,854,912 (~17.9 Mbit)
User I/O Count — 554
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Core Voltage — 0.9 V
Package Type — 1152-BBGA, FCBGA (flip-chip)
Terminal Form — Ball
Package Code (JEDEC) — HBGA
Operating Temperature Grade — Commercial (C4 = 0C to +85C)
Configuration Memory — SRAM-based (volatile, requires boot device)
PLLs — [DATA_NEEDED: PLL count]
Lead-Free Status — Lead free (per Besenchips listing)
Tipe Mounting — Surface Mount
Maximum Operating Frequency — 500 MHz

Spek dan Sumber

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