EP2SGX30CF780I3 vs EP2SGX30CF780C3 Perbandingan
Perbandingan bersamaan detil EP2SGX30CF780I3 dari Intel dan EP2SGX30CF780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2SGX30CF780I3 | EP2SGX30CF780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | 1,694 |
| Maximum Internal Frequency | 622.08 MHz | — |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | Embedded (GX family, up to 3.125 Gbps per channel) |
| Paket | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FineLine BGA |
| Terminal Pitch | 1.0 mm | — |
| Suhu Kerja | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial) |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| Status RoHS | [DATA_NEEDED: RoHS status not confirmed in supplied data] | Compliant |
| Logic Elements | — | 33,880 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Speed Grade | — | -3 |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Lead-Free | — | Yes |
| Bebas Halogen | — | [DATA_NEEDED: halogen-free status] |