EP2SGX30CF780I3 vs EP2SGX30CF780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30CF780I3 disebabkan oleh Intel dan EP2SGX30CF780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX30CF780I3 | EP2SGX30CF780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | 1,694 |
| Maximum Internal Frequency | 622.08 MHz | — |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | Embedded (GX family, up to 3.125 Gbps per channel) |
| Kemasan | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FineLine BGA |
| Terminal Pitch | 1.0 mm | — |
| Suhu Operasi | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial) |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| Status RoHS | [DATA_NEEDED: RoHS status not confirmed in supplied data] | Compliant |
| Logic Elements | — | 33,880 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Speed Grade | — | -3 |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Lead-Free | — | Yes |
| Boson Bebas | — | [DATA_NEEDED: halogen-free status] |