EP2SGX30DF780I3N vs EP2SGX30CF780I4N Perbandingan
Perbandingan bersamaan detil EP2SGX30DF780I3N dari Intel dan EP2SGX30CF780I4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30DF780I3N | EP2SGX30CF780I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Logic Cells | 33,380 | — |
| Configurable Logic Blocks (CLBs) | 33,880 | — |
| Total Memory Bits | 1,369,728 | — |
| Maximum Core Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| User I/O Pins | 361 | — |
| Paket | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Speed Grade | I3 | — |
| Logic Cells / CLBs | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Embedded Transceivers | — | 4 channels (up to 3.125 Gbps at C4) |
| Pin / Terminal Count | — | 780 |
| Suhu Kerja | — | -40C to +85C (Industrial) |
| Lead-Free | — | Yes |
| Tipe Memori | — | Embedded SRAM, external DDR/DDR2/QDR support |
| Configuration | — | JTAG / passive serial / fast passive parallel |