EP2SGX30DF780I3N vs EP2SGX30CF780I4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30DF780I3N disebabkan oleh Intel dan EP2SGX30CF780I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX30DF780I3N | EP2SGX30CF780I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Logic Cells | 33,380 | — |
| Configurable Logic Blocks (CLBs) | 33,880 | — |
| Total Memory Bits | 1,369,728 | — |
| Maximum Core Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| User I/O Pins | 361 | — |
| Kemasan | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Speed Grade | I3 | — |
| Logic Cells / CLBs | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Embedded Transceivers | — | 4 channels (up to 3.125 Gbps at C4) |
| Pin / Terminal Count | — | 780 |
| Suhu Operasi | — | -40C to +85C (Industrial) |
| Lead-Free | — | Yes |
| Jenis Ingatan | — | Embedded SRAM, external DDR/DDR2/QDR support |
| Configuration | — | JTAG / passive serial / fast passive parallel |