EP2SGX90EF1152C3N vs EP2SGX90EF1152I3 Perbandingan
Perbandingan bersamaan detil EP2SGX90EF1152C3N dari Intel dan EP2SGX90EF1152I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
EP2SGX90EF1152I3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP2SGX90EF1152C3N | EP2SGX90EF1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Series | Stratix II GX | Stratix II GX |
| Family | Stratix II GX | — |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Operating Frequency (max) | 816.9 MHz | — |
| Suhu Kerja | 0C to +85C (Commercial) | — |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (flip-chip) |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | — |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Total RAM Bits | — | 4,520,448 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |
| Status RoHS | — | Compliant |