EP2SGX90EF1152C3N vs EP2SGX90EF1152I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90EF1152C3N sa pamamagitan ng Intel at EP2SGX90EF1152I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP2SGX90EF1152C3N EP2SGX90EF1152I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Series Stratix II GX Stratix II GX
Family Stratix II GX —
Logic Elements (LE) 90960 —
Number of LABs/CLBs 4548 —
Total Memory Bits 4520448 —
User I/Os 558 —
Number of Transceivers [DATA_NEEDED: transceiver count per family] —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Operating Frequency (max) 816.9 MHz —
Temperature na Operasyon 0C to +85C (Commercial) —
Package Type FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-ball FC-FBGA (flip-chip)
Package Pin Count 1152 balls —
Package Dimensions 34 mm x 34 mm —
Uri ng Pagpapasok Surface Mount Surface Mount
Lead-Free / RoHS Yes (RoHS compliant) —
Speed Grade EF —
Temperature Grade C3 (Commercial) —
Logic Elements — 90,960
Adaptive Logic Modules (ALMs) — 558
Equivalent Logic Cells (CLBs) — 90,960
Total RAM Bits — 4,520,448
Maximum Operating Frequency — 622.08 MHz
Core Supply Voltage (VCCINT) — 1.2 V nominal (1.15 V to 1.25 V)
Operating Temperature Grade — Industrial (-40C to +100C)
Terminal Form — Ball
Terminal Pitch — [DATA_NEEDED: ball pitch]
Package Code — BGA
Package Shape — Square
Configuration Architecture — Enhanced Configuration (EPC) devices supported
Tindminan RoHS — Compliant

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