EP2SGX90EF1152C3N vs EP2SGX90EF1152I3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C3N disebabkan oleh Intel dan EP2SGX90EF1152I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX90EF1152C3N EP2SGX90EF1152I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Masa Terakhir Dibeli
Series Stratix II GX Stratix II GX
Family Stratix II GX —
Logic Elements (LE) 90960 —
Number of LABs/CLBs 4548 —
Total Memory Bits 4520448 —
User I/Os 558 —
Number of Transceivers [DATA_NEEDED: transceiver count per family] —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Operating Frequency (max) 816.9 MHz —
Suhu Operasi 0C to +85C (Commercial) —
Package Type FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-ball FC-FBGA (flip-chip)
Package Pin Count 1152 balls —
Package Dimensions 34 mm x 34 mm —
Jenis Pemasangan Surface Mount Surface Mount
Lead-Free / RoHS Yes (RoHS compliant) —
Speed Grade EF —
Temperature Grade C3 (Commercial) —
Logic Elements — 90,960
Adaptive Logic Modules (ALMs) — 558
Equivalent Logic Cells (CLBs) — 90,960
Total RAM Bits — 4,520,448
Maximum Operating Frequency — 622.08 MHz
Core Supply Voltage (VCCINT) — 1.2 V nominal (1.15 V to 1.25 V)
Operating Temperature Grade — Industrial (-40C to +100C)
Terminal Form — Ball
Terminal Pitch — [DATA_NEEDED: ball pitch]
Package Code — BGA
Package Shape — Square
Configuration Architecture — Enhanced Configuration (EPC) devices supported
Status RoHS — Compliant

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