EP3C25F256C8 vs EP3C25F256I7N Perbandingan
Perbandingan bersamaan detil EP3C25F256C8 dari Intel dan EP3C25F256I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F256C8 | EP3C25F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Cyclone III FPGA | FPGA |
| Logic Cells | 24,624 cells | — |
| Maximum Frequency | 402 MHz | — |
| Fabrication Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Embedded Memory | 608,256 bits | 608,256 bits |
| User I/O Count | 156 I/Os | — |
| Logic Blocks | 1,539 LABs | — |
| Package Type | 256-pin FBGA | — |
| Package Pin Count | 256 pins | — |
| Package Standard | MS-034 FBGA-256 | — |
| Tipe Mounting | Surface mount | Surface Mount |
| Suhu Kerja | -40 °C to +125 °C | -40C to +125C |
| Lead-Free Status | Lead-free package | — |
| Programmable Logic Type | SRAM-configured FPGA | — |
| FPGA Family | Cyclone III | — |
| Product Category | Field programmable gate arrays | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free) |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| Configuration Method | [DATA_NEEDED: supported configuration methods] | — |
| Differential I/O Standards | [DATA_NEEDED: supported differential I/O standards] | — |
| Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| Paket | — | 256-FBGA (FineLine BGA) |
| Speed Grade | — | 7 |
| Process Technology | — | 65 nm low-power |
| PLLs | — | 4 general-purpose PLLs |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Hot Socketing | — | Supported |
| Configuration | — | SRAM-based, in-system programmable |