EP3C25F256C8 vs EP3C25F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F256C8 disebabkan oleh Intel dan EP3C25F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F256C8 | EP3C25F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Cyclone III FPGA | FPGA |
| Logic Cells | 24,624 cells | — |
| Maximum Frequency | 402 MHz | — |
| Fabrication Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Embedded Memory | 608,256 bits | 608,256 bits |
| User I/O Count | 156 I/Os | — |
| Logic Blocks | 1,539 LABs | — |
| Package Type | 256-pin FBGA | — |
| Package Pin Count | 256 pins | — |
| Package Standard | MS-034 FBGA-256 | — |
| Jenis Pemasangan | Surface mount | Surface Mount |
| Suhu Operasi | -40 °C to +125 °C | -40C to +125C |
| Lead-Free Status | Lead-free package | — |
| Programmable Logic Type | SRAM-configured FPGA | — |
| FPGA Family | Cyclone III | — |
| Product Category | Field programmable gate arrays | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free) |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| Configuration Method | [DATA_NEEDED: supported configuration methods] | — |
| Differential I/O Standards | [DATA_NEEDED: supported differential I/O standards] | — |
| Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| Kemasan | — | 256-FBGA (FineLine BGA) |
| Speed Grade | — | 7 |
| Process Technology | — | 65 nm low-power |
| PLLs | — | 4 general-purpose PLLs |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Hot Socketing | — | Supported |
| Configuration | — | SRAM-based, in-system programmable |