EP3C25F256C8 vs EP3C25F256I7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F256C8 sa pamamagitan ng Intel at EP3C25F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3C25F256C8 EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial

EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial

EP3C25F256C8 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro EP3C25F256C8 EP3C25F256I7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Type Cyclone III FPGA FPGA
Logic Cells 24,624 cells —
Maximum Frequency 402 MHz —
Fabrication Technology 65 nm —
Core Supply Voltage 1.2 V 1.2 V
Embedded Memory 608,256 bits 608,256 bits
User I/O Count 156 I/Os —
Logic Blocks 1,539 LABs —
Package Type 256-pin FBGA —
Package Pin Count 256 pins —
Package Standard MS-034 FBGA-256 —
Uri ng Pagpapasok Surface mount Surface Mount
Temperature na Operasyon -40 °C to +125 °C -40C to +125C
Lead-Free Status Lead-free package —
Programmable Logic Type SRAM-configured FPGA —
FPGA Family Cyclone III —
Product Category Field programmable gate arrays —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] Compliant (lead-free)
REACH Status [DATA_NEEDED: REACH compliance status] —
Configuration Method [DATA_NEEDED: supported configuration methods] —
Differential I/O Standards [DATA_NEEDED: supported differential I/O standards] —
Family — Cyclone III
Logic Elements — 24,624
Embedded Multipliers — 66 (18x18)
Maximum User I/O — 156
Packhaging — 256-FBGA (FineLine BGA)
Speed Grade — 7
Process Technology — 65 nm low-power
PLLs — 4 general-purpose PLLs
External Memory Support — DDR/DDR2/QDRII/QDRII+
Hot Socketing — Supported
Configuration — SRAM-based, in-system programmable

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