EP3C25F256C8 vs EP3C25F256I7N 比較
詳細並排比較 EP3C25F256C8 由 Intel 與 EP3C25F256I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C25F256C8 | EP3C25F256I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Device Type | Cyclone III FPGA | FPGA |
| Logic Cells | 24,624 cells | — |
| Maximum Frequency | 402 MHz | — |
| Fabrication Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Embedded Memory | 608,256 bits | 608,256 bits |
| User I/O Count | 156 I/Os | — |
| Logic Blocks | 1,539 LABs | — |
| Package Type | 256-pin FBGA | — |
| Package Pin Count | 256 pins | — |
| Package Standard | MS-034 FBGA-256 | — |
| 安裝類型 | Surface mount | Surface Mount |
| 工作溫度 | -40 °C to +125 °C | -40C to +125C |
| Lead-Free Status | Lead-free package | — |
| Programmable Logic Type | SRAM-configured FPGA | — |
| FPGA Family | Cyclone III | — |
| Product Category | Field programmable gate arrays | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free) |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| Configuration Method | [DATA_NEEDED: supported configuration methods] | — |
| Differential I/O Standards | [DATA_NEEDED: supported differential I/O standards] | — |
| Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| 封裝 | — | 256-FBGA (FineLine BGA) |
| Speed Grade | — | 7 |
| Process Technology | — | 65 nm low-power |
| PLLs | — | 4 general-purpose PLLs |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Hot Socketing | — | Supported |
| Configuration | — | SRAM-based, in-system programmable |