EP3C25F324C8 vs EP3C25F324C6N Perbandingan
Perbandingan bersamaan detil EP3C25F324C8 dari Intel dan EP3C25F324C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324C8 | EP3C25F324C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 24,624 LE | — |
| Logic Array Blocks | 1,539 LABs | — |
| Embedded Memory | 608,256 bits | — |
| Embedded Multipliers | 66 (18 x 18) | 66 (18x18) |
| User I/Os | 215 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Process Technology | 65 nm CMOS, SRAM-based | TSMC 65 nm low-power (LP) |
| Core Voltage | 1.2 V | — |
| Speed Grade | 8 (commercial) | C6 (commercial) |
| Suhu Kerja | 0 °C to +85 °C (commercial) | 0C to +85C (commercial) |
| Paket | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-BGA (FBGA-324), fine-pitch |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Maximum Internal Clock | 402 MHz | — |
| Status RoHS | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | — |
| Family | — | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LE) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |