EP3C25F324C8 vs EP3C25F324C6N 比較

詳細並排比較 EP3C25F324C8 由 Intel 與 EP3C25F324C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C25F324C8 EP3C25F324C6N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Series Cyclone III Cyclone III
Logic Elements 24,624 LE —
Logic Array Blocks 1,539 LABs —
Embedded Memory 608,256 bits —
Embedded Multipliers 66 (18 x 18) 66 (18x18)
User I/Os 215 —
PLLs 4 4 general-purpose PLLs
Process Technology 65 nm CMOS, SRAM-based TSMC 65 nm low-power (LP)
Core Voltage 1.2 V —
Speed Grade 8 (commercial) C6 (commercial)
工作溫度 0 °C to +85 °C (commercial) 0C to +85C (commercial)
封裝 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch 324-BGA (FBGA-324), fine-pitch
安裝類型 Surface Mount (BGA) Surface Mount
Maximum Internal Clock 402 MHz —
RoHS 狀態 Non-compliant (per Lisleapex listing; original part number without 'N' suffix) —
Family — Cyclone III (low-power, low-cost FPGA)
Logic Elements (LE) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory Blocks — M9K blocks, 66 total
DSP Blocks — 66 dedicated 18x18 multipliers
User I/O Pins — 215
Number of I/O Banks — 8
Configuration Schemes — Passive Serial, Fast Passive Parallel, JTAG
Lead-Free / RoHS — Yes (lead-free, RoHS compliant)

資料表與資源

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