EP3C25F324I7N vs EP3C25F324C6N Perbandingan
Perbandingan bersamaan detil EP3C25F324I7N dari Intel dan EP3C25F324C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324I7N | EP3C25F324C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LEs) | 24,624 | — |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) | — |
| Embedded 18x18 Multipliers | 66 | — |
| Maximum User I/O Pins | 215 | — |
| LVDS Pairs | 66 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm | TSMC 65 nm low-power (LP) |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) | — |
| Paket | 324-ball FBGA (Fine-Pitch BGA) | 324-BGA (FBGA-324), fine-pitch |
| Suhu Kerja | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Speed Grade | 7 (slower speed grade, lower power) | C6 (commercial) |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Level MSL | 3 (168 hours) | — |
| Series | — | Cyclone III |
| Logic Elements (LE) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| Tipe Mounting | — | Surface Mount |