EP3C25F324I7N vs EP3C25F324C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324I7N sa pamamagitan ng Intel at EP3C25F324C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324I7N | EP3C25F324C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LEs) | 24,624 | — |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) | — |
| Embedded 18x18 Multipliers | 66 | — |
| Maximum User I/O Pins | 215 | — |
| LVDS Pairs | 66 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm | TSMC 65 nm low-power (LP) |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) | — |
| Packhaging | 324-ball FBGA (Fine-Pitch BGA) | 324-BGA (FBGA-324), fine-pitch |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Speed Grade | 7 (slower speed grade, lower power) | C6 (commercial) |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Level ng MSL | 3 (168 hours) | — |
| Series | — | Cyclone III |
| Logic Elements (LE) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| Uri ng Pagpapasok | — | Surface Mount |