EP3C25F324I7N vs EP3C25F324C6N 比較

詳細並排比較 EP3C25F324I7N 由 Intel 與 EP3C25F324C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C25F324I7N EP3C25F324C6N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone III Cyclone III (low-power, low-cost FPGA)
Logic Elements (LEs) 24,624 —
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) —
Embedded 18x18 Multipliers 66 —
Maximum User I/O Pins 215 —
LVDS Pairs 66 —
PLLs 4 4 general-purpose PLLs
Global Clock Networks 20 —
Process Technology 65 nm TSMC 65 nm low-power (LP)
Core Voltage 1.2 V —
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) —
封裝 324-ball FBGA (Fine-Pitch BGA) 324-BGA (FBGA-324), fine-pitch
工作溫度 -40C to +100C (Industrial) 0C to +85C (commercial)
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) —
Speed Grade 7 (slower speed grade, lower power) C6 (commercial)
RoHS 狀態 Compliant —
Lead-Free Yes —
MSL 等級 3 (168 hours) —
Series — Cyclone III
Logic Elements (LE) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory Blocks — M9K blocks, 66 total
Embedded Multipliers — 66 (18x18)
DSP Blocks — 66 dedicated 18x18 multipliers
User I/O Pins — 215
Number of I/O Banks — 8
Configuration Schemes — Passive Serial, Fast Passive Parallel, JTAG
Lead-Free / RoHS — Yes (lead-free, RoHS compliant)
安裝類型 — Surface Mount

資料表與資源

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