EP3C25F324I7N vs EP3C25F324C6N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324I7N disebabkan oleh Intel dan EP3C25F324C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C25F324I7N EP3C25F324C6N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone III Cyclone III (low-power, low-cost FPGA)
Logic Elements (LEs) 24,624 —
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) —
Embedded 18x18 Multipliers 66 —
Maximum User I/O Pins 215 —
LVDS Pairs 66 —
PLLs 4 4 general-purpose PLLs
Global Clock Networks 20 —
Process Technology 65 nm TSMC 65 nm low-power (LP)
Core Voltage 1.2 V —
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) —
Kemasan 324-ball FBGA (Fine-Pitch BGA) 324-BGA (FBGA-324), fine-pitch
Suhu Operasi -40C to +100C (Industrial) 0C to +85C (commercial)
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) —
Speed Grade 7 (slower speed grade, lower power) C6 (commercial)
Status RoHS Compliant —
Lead-Free Yes —
Aras MSL 3 (168 hours) —
Series — Cyclone III
Logic Elements (LE) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory Blocks — M9K blocks, 66 total
Embedded Multipliers — 66 (18x18)
DSP Blocks — 66 dedicated 18x18 multipliers
User I/O Pins — 215
Number of I/O Banks — 8
Configuration Schemes — Passive Serial, Fast Passive Parallel, JTAG
Lead-Free / RoHS — Yes (lead-free, RoHS compliant)
Jenis Pemasangan — Surface Mount

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