EP3C40F484C8 vs EP3C40F484C7N Perbandingan
Perbandingan bersamaan detil EP3C40F484C8 dari Intel dan EP3C40F484C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C40F484C8 | EP3C40F484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Device Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Logic Array Blocks (LAB) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| M9K Memory Blocks | 126 | — |
| Embedded 18x18 Multipliers | 56 | 126 |
| PLLs | 4 | 4 |
| Maximum User I/O | 331 | — |
| User I/O Banks | 8 | — |
| Paket | 484-ball FBGA (F484), 1.0 mm pitch, 23 x 23 mm | 484-FBGA (F484), 1.0 mm pitch |
| Speed Grade | C8 (commercial, mid-speed) | — |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| Process Node | 60 nm TSMC low-power CMOS | — |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Scheme | Active serial (AS), Passive serial (PS), JTAG | — |
| Status RoHS | Compliant (lead-free FBGA) | Compliant (lead-free FBGA) |
| Level MSL | 3 (per JEDEC J-STD-020) | 3 |
| Logic Elements | — | 39,600 |
| Total Memory Bits | — | 1,161,216 |
| Global Clock Networks | — | 20 |
| User I/Os | — | 331 |
| Process Technology | — | 65 nm low-power |
| Configuration Memory | — | SRAM-based |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, PCI |
| Tipe Mounting | — | Surface Mount |