EP3C40F484C8 vs EP3C40F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F484C8 sa pamamagitan ng Intel at EP3C40F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C40F484C8 | EP3C40F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Device Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Logic Array Blocks (LAB) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| M9K Memory Blocks | 126 | — |
| Embedded 18x18 Multipliers | 56 | 126 |
| PLLs | 4 | 4 |
| Maximum User I/O | 331 | — |
| User I/O Banks | 8 | — |
| Packhaging | 484-ball FBGA (F484), 1.0 mm pitch, 23 x 23 mm | 484-FBGA (F484), 1.0 mm pitch |
| Speed Grade | C8 (commercial, mid-speed) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| Process Node | 60 nm TSMC low-power CMOS | — |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Scheme | Active serial (AS), Passive serial (PS), JTAG | — |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant (lead-free FBGA) |
| Level ng MSL | 3 (per JEDEC J-STD-020) | 3 |
| Logic Elements | — | 39,600 |
| Total Memory Bits | — | 1,161,216 |
| Global Clock Networks | — | 20 |
| User I/Os | — | 331 |
| Process Technology | — | 65 nm low-power |
| Configuration Memory | — | SRAM-based |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, PCI |
| Uri ng Pagpapasok | — | Surface Mount |