EP3C80U484C7 vs EP3C55U484C7 Perbandingan
Perbandingan bersamaan detil EP3C80U484C7 dari Intel dan EP3C55U484C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C80U484C7 | EP3C55U484C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Family | EP3C80 | — |
| Logic Elements | 81,264 | — |
| Embedded Memory | 2,810,880 bits (295 M9K blocks) | — |
| Embedded 18x18 Multipliers | 244 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 429 (approximate, package-dependent) | 327 |
| Paket | 484-FBGA (UBGA) | 484-ball UBGA (Ultra-FineLine BGA) |
| Speed Grade | -7 (commercial) | C7 (Commercial) |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Range | 1.2 V to 3.3 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS |
| Suhu Hubung Kerja | 0 C to 85 C (commercial) | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG, AES-encrypted bitstream | — |
| Memory Interface Support | DDR, DDR2, QDRII SDRAM | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,488 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Multipliers (18x18) | — | 156 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | 437 MHz |
| I/O Bank Voltages | — | 1.2 V / 2.5 V / 3.0 V / 3.3 V |
| Package Dimensions | — | 19 x 19 mm |
| Ball Pitch | — | 0.80 mm |
| Suhu Kerja | — | 0C to +85C (Commercial) |
| Tipe Mounting | — | Surface Mount (BGA) |