EP3C80U484C7 vs EP3C55U484C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C80U484C7 disebabkan oleh Intel dan EP3C55U484C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C80U484C7 | EP3C55U484C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Family | EP3C80 | — |
| Logic Elements | 81,264 | — |
| Embedded Memory | 2,810,880 bits (295 M9K blocks) | — |
| Embedded 18x18 Multipliers | 244 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 429 (approximate, package-dependent) | 327 |
| Kemasan | 484-FBGA (UBGA) | 484-ball UBGA (Ultra-FineLine BGA) |
| Speed Grade | -7 (commercial) | C7 (Commercial) |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Range | 1.2 V to 3.3 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS |
| Suhu Hubungan Operasi | 0 C to 85 C (commercial) | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG, AES-encrypted bitstream | — |
| Memory Interface Support | DDR, DDR2, QDRII SDRAM | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,488 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Multipliers (18x18) | — | 156 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | 437 MHz |
| I/O Bank Voltages | — | 1.2 V / 2.5 V / 3.0 V / 3.3 V |
| Package Dimensions | — | 19 x 19 mm |
| Ball Pitch | — | 0.80 mm |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| Jenis Pemasangan | — | Surface Mount (BGA) |