EP3CLS200F484C8 vs EP3CLS200F484C7N Perbandingan
Perbandingan bersamaan detil EP3CLS200F484C8 dari Intel dan EP3CLS200F484C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS200F484C8 | EP3CLS200F484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone III LS (low-power Cyclone III) | — |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LAB) | 20,5056 (approx) | 12,404 |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | 8,211,456 bits |
| Embedded 18x18 Multipliers | 210 | 210 |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Paket | 484-pin FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | AS, PS, JTAG (IEEE 1149.1) |
| Security | Design encryption / bitstream AES | — |
| Suhu Kerja | 0C to +85C (commercial, 'C' suffix) | 0C to +85C (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| User I/O | — | 226 |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |