EP3CLS200F780I7N vs EP3CLS200F780C8ES Perbandingan
Perbandingan bersamaan detil EP3CLS200F780I7N dari Intel dan EP3CLS200F780C8ES dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS200F780I7N | EP3CLS200F780C8ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | Cyclone III LS |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 LAB | 12,404 |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 413 | 413 |
| Process Technology | 65 nm CMOS (low-power) | 65 nm CMOS (low-power) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | 8 |
| Suhu Kerja | -40 °C to +100 °C (industrial) | — |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Paket | 780-ball FBGA (FBGA-780) | 780-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free per FBGA-780 datasheet note) | Compliant (lead-free FBGA) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded 18x18 Multipliers | — | 396 |
| Core Supply Voltage | — | 1.2 V |
| Suhu Hubung Kerja | — | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | — | 402 MHz (typical) |
| Configuration Encryption | — | AES bitstream encryption (LS feature) |
| On-Chip Termination (OCT) | — | Yes (calibrated) |
| Hot Socketing | — | Supported |