EP3CLS70F780I7 vs EP3CLS70F780I7N Perbandingan

Perbandingan bersamaan detil EP3CLS70F780I7 dari Intel dan EP3CLS70F780I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3CLS70F780I7 EP3CLS70F780I7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone III LS —
Logic Elements (LEs) 70,208 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory Bits 3,068,928 bits (2.93 Mbit) —
Embedded Memory Blocks (M9K) [DATA_NEEDED: M9K count] —
Hardware Multipliers (18x18) 413 —
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/Os 429 —
Paket 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) —
Operating Temperature (Industrial, 'I') -40C to +100C (case) —
Core Supply Voltage (VCCINT) 1.15 V to 1.25 V —
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Configuration Support JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) —
Bitstream Encryption AES-128/256 (LS-family feature) —
Process Node 60 nm TSMC low-power —
Status RoHS Non-compliant (per Cyclone III LS datasheet prefix per verified data) unknown
Speed Grade 7 (moderate) —
Device Type — Field Programmable Gate Array (FPGA)
Series — Cyclone III LS
Logic Elements — 70,208
Embedded Memory — 3,068,928 bits
Maximum User I/O — 413 pins
Tegangan Pemuat — 1.2 V
Temperature Grade — Industrial
Package Type — BGA
Package Pin Count — 780 balls
Package Shape — Square
Terminal Form — Ball
Configuration Technology — SRAM-based FPGA
Configuration Method — [DATA_NEEDED: configuration method]
Suhu Kerja — [DATA_NEEDED: operating temperature]
Tipe Mounting — Surface Mount
REACH Status — unknown
AEC-Q100 Qualification — unknown

Spek dan Sumber

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