EP3CLS70F780I7 vs EP3CLS70F780I7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS70F780I7 disebabkan oleh Intel dan EP3CLS70F780I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3CLS70F780I7 EP3CLS70F780I7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone III LS —
Logic Elements (LEs) 70,208 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory Bits 3,068,928 bits (2.93 Mbit) —
Embedded Memory Blocks (M9K) [DATA_NEEDED: M9K count] —
Hardware Multipliers (18x18) 413 —
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/Os 429 —
Kemasan 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) —
Operating Temperature (Industrial, 'I') -40C to +100C (case) —
Core Supply Voltage (VCCINT) 1.15 V to 1.25 V —
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Configuration Support JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) —
Bitstream Encryption AES-128/256 (LS-family feature) —
Process Node 60 nm TSMC low-power —
Status RoHS Non-compliant (per Cyclone III LS datasheet prefix per verified data) unknown
Speed Grade 7 (moderate) —
Device Type — Field Programmable Gate Array (FPGA)
Series — Cyclone III LS
Logic Elements — 70,208
Embedded Memory — 3,068,928 bits
Maximum User I/O — 413 pins
Tegangan Pemberi Arus — 1.2 V
Temperature Grade — Industrial
Package Type — BGA
Package Pin Count — 780 balls
Package Shape — Square
Terminal Form — Ball
Configuration Technology — SRAM-based FPGA
Configuration Method — [DATA_NEEDED: configuration method]
Suhu Operasi — [DATA_NEEDED: operating temperature]
Jenis Pemasangan — Surface Mount
REACH Status — unknown
AEC-Q100 Qualification — unknown

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