EP3CLS70F780I7 vs EP3CLS70F780I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F780I7 sa pamamagitan ng Intel at EP3CLS70F780I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS70F780I7 | EP3CLS70F780I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | — |
| Logic Elements (LEs) | 70,208 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 3,068,928 bits (2.93 Mbit) | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 413 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/Os | 429 | — |
| Packhaging | 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) | — |
| Operating Temperature (Industrial, 'I') | -40C to +100C (case) | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Support | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| Bitstream Encryption | AES-128/256 (LS-family feature) | — |
| Process Node | 60 nm TSMC low-power | — |
| Tindminan RoHS | Non-compliant (per Cyclone III LS datasheet prefix per verified data) | unknown |
| Speed Grade | 7 (moderate) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Logic Elements | — | 70,208 |
| Embedded Memory | — | 3,068,928 bits |
| Maximum User I/O | — | 413 pins |
| Volte ng Pagbibigay | — | 1.2 V |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature] |
| Uri ng Pagpapasok | — | Surface Mount |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |