EP3SE260F1152C2 vs EP3SE260F1152C4 Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C2 dari Intel dan EP3SE260F1152C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C2 | EP3SE260F1152C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix® III E | Stratix III E (Enhanced) |
| Logic Elements (LE) | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 744 | — |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS (TSMC) |
| Paket | 1152-ball FC-FBGA (Flip Chip) | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Speed Grade | C2 (commercial) | C4 (slowest commercial grade) |
| Suhu Kerja | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] | Commercial (0C to +85C) - inferred from speed grade C4 |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Lead-Free | Yes | — |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Design Software | Quartus II (Stratix III support) | — |
| Family | — | Stratix III |
| Embedded Memory Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | ~450 MHz (per FPGAkey listing) |
| Package Code | — | BGA, square |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG |
| DSP Blocks (18x18 Multipliers) | — | 384 |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Transceivers | — | External PHY interface only (no integrated GXB) |