EP3SE260F1152C2 vs EP3SE260F1152C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2 sa pamamagitan ng Intel at EP3SE260F1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C2 EP3SE260F1152C4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Manufacturer Intel (formerly Altera) —
Series Stratix® III E Stratix III E (Enhanced)
Logic Elements (LE) 255,000 255,000
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS (TSMC)
Packhaging 1152-ball FC-FBGA (Flip Chip) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Speed Grade C2 (commercial) C4 (slowest commercial grade)
Temperature na Operasyon Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] Commercial (0C to +85C) - inferred from speed grade C4
Tindminan RoHS Compliant Compliant (per distributor listings)
Lead-Free Yes —
Level ng MSL [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Core Voltage — 1.1 V
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)

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