EP3SE260F1152C3N vs EP3SE260F1152C4 Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C3N dari Intel dan EP3SE260F1152C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C3N EP3SE260F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif NRND
Series Stratix III E Stratix III E (Enhanced)
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits 16,672,768
Logic Array Blocks (LABs) 10,200 10,200
User I/O Count 744 744
Paket 1152-BBGA, FCBGA 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Tipe Mounting Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm CMOS (TSMC)
Core Voltage 1.1 V 1.1 V
Suhu Kerja 0 C to +85 C (Commercial) Commercial (0C to +85C) - inferred from speed grade C4
Transceivers Integrated high-speed transceivers External PHY interface only (no integrated GXB)
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG Passive Serial, Fast Passive Parallel, JTAG
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
Status RoHS Compliant Compliant (per distributor listings)
Family — Stratix III
Logic Elements (LE) — 255,000
Speed Grade — C4 (slowest commercial grade)
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]

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