EP3SE260F1152C3N vs EP3SE260F1152C4 比較

詳細並排比較 EP3SE260F1152C3N 由 Intel 與 EP3SE260F1152C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260F1152C3N EP3SE260F1152C4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 NRND
Series Stratix III E Stratix III E (Enhanced)
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits 16,672,768
Logic Array Blocks (LABs) 10,200 10,200
User I/O Count 744 744
封裝 1152-BBGA, FCBGA 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
安裝類型 Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm CMOS (TSMC)
Core Voltage 1.1 V 1.1 V
工作溫度 0 C to +85 C (Commercial) Commercial (0C to +85C) - inferred from speed grade C4
Transceivers Integrated high-speed transceivers External PHY interface only (no integrated GXB)
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG Passive Serial, Fast Passive Parallel, JTAG
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
RoHS 狀態 Compliant Compliant (per distributor listings)
Family — Stratix III
Logic Elements (LE) — 255,000
Speed Grade — C4 (slowest commercial grade)
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]

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