EP3SE260F1152C3N vs EP3SE260F1152C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3N sa pamamagitan ng Intel at EP3SE260F1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C3N EP3SE260F1152C4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Series Stratix III E Stratix III E (Enhanced)
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits 16,672,768
Logic Array Blocks (LABs) 10,200 10,200
User I/O Count 744 744
Packhaging 1152-BBGA, FCBGA 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm CMOS (TSMC)
Core Voltage 1.1 V 1.1 V
Temperature na Operasyon 0 C to +85 C (Commercial) Commercial (0C to +85C) - inferred from speed grade C4
Transceivers Integrated high-speed transceivers External PHY interface only (no integrated GXB)
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG Passive Serial, Fast Passive Parallel, JTAG
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
Tindminan RoHS Compliant Compliant (per distributor listings)
Family — Stratix III
Logic Elements (LE) — 255,000
Speed Grade — C4 (slowest commercial grade)
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]

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