EP3SE260F1152C4 vs EP3SE260F1152C3 Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C4 dari Intel dan EP3SE260F1152C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C4 | EP3SE260F1152C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Series | Stratix III E (Enhanced) | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 40 nm |
| Core Voltage | 1.1 V | 0.9 V to 1.1 V |
| Speed Grade | C4 (slowest commercial grade) | C3 |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| Paket | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Suhu Kerja | Commercial (0C to +85C) - inferred from speed grade C4 | 0C to +85C (Commercial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| Embedded 18x18 Multipliers | — | 384 |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |