EP3SE260F1152C4 vs EP3SE260F1152C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C4 sa pamamagitan ng Intel at EP3SE260F1152C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C4 EP3SE260F1152C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Series Stratix III E (Enhanced) Stratix III E
Family Stratix III —
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory Bits 16,672,768 —
User I/O Count 744 —
Process Technology 65 nm CMOS (TSMC) 40 nm
Core Voltage 1.1 V 0.9 V to 1.1 V
Speed Grade C4 (slowest commercial grade) C3
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) —
Packhaging 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-ball FCBGA (Flip-Chip BGA)
Package Code BGA, square —
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
DSP Blocks (18x18 Multipliers) 384 —
PLL Count [DATA_NEEDED: PLL count] —
Transceivers External PHY interface only (no integrated GXB) —
Tindminan RoHS Compliant (per distributor listings) Compliant
Temperature na Operasyon Commercial (0C to +85C) - inferred from speed grade C4 0C to +85C (Commercial)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Logic Elements — 255,000
Embedded Memory (bits) — 16,672,768
User I/Os — 744
Embedded 18x18 Multipliers — 384
Configuration Method — Passive Serial / Fast Passive Parallel / JTAG
PLLs — 12

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita