EP3SE260F1152C4N vs EP3SE260F1152C4 Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C4N dari Intel dan EP3SE260F1152C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C4N EP3SE260F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Series Stratix III E Stratix III E (Enhanced)
Family Stratix III (Enhanced) Stratix III
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 65 nm CMOS (TSMC)
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz —
Paket 1152-ball FC-FBGA (flip-chip) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Speed Grade -4 (commercial temperature) C4 (slowest commercial grade)
Suhu Kerja 0C to +85C (commercial, 'C' suffix) Commercial (0C to +85C) - inferred from speed grade C4
Tipe Mounting Surface Mount (BGA) Surface Mount (BGA)
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
Tipe Memori SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Logic Elements (LE) — 255,000
Logic Array Blocks (LABs) — 10,200
Embedded Memory Bits — 16,672,768
User I/O Count — 744
Maximum Internal Frequency — ~450 MHz (per FPGAkey listing)
Package Code — BGA, square
I/O Standards Supported — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) — 384
PLL Count — [DATA_NEEDED: PLL count]
Transceivers — External PHY interface only (no integrated GXB)
Status RoHS — Compliant (per distributor listings)

Spek dan Sumber

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