EP3SE260F1152C4N vs EP3SE260F1152C4 比較
詳細並排比較 EP3SE260F1152C4N 由 Intel 與 EP3SE260F1152C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1152C4N | EP3SE260F1152C4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Series | Stratix III E | Stratix III E (Enhanced) |
| Family | Stratix III (Enhanced) | Stratix III |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | — |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS (TSMC) |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 450 MHz | — |
| 封裝 | 1152-ball FC-FBGA (flip-chip) | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Speed Grade | -4 (commercial temperature) | C4 (slowest commercial grade) |
| 工作溫度 | 0C to +85C (commercial, 'C' suffix) | Commercial (0C to +85C) - inferred from speed grade C4 |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| 記憶體類型 | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | — |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Maximum Internal Frequency | — | ~450 MHz (per FPGAkey listing) |
| Package Code | — | BGA, square |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG |
| DSP Blocks (18x18 Multipliers) | — | 384 |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Transceivers | — | External PHY interface only (no integrated GXB) |
| RoHS 狀態 | — | Compliant (per distributor listings) |