EP3SE260F1152C4N vs EP3SE260F1152I3 Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C4N dari Intel dan EP3SE260F1152I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C4N | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family | Stratix III (Enhanced) | — |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | 10,200 |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 450 MHz | — |
| Paket | 1152-ball FC-FBGA (flip-chip) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Speed Grade | -4 (commercial temperature) | I3 (Industrial, speed bin 3) |
| Suhu Kerja | 0C to +85C (commercial, 'C' suffix) | -40C to +100C (Industrial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| Tipe Memori | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | Obsolete (per Xecor comparator) |
| Logic Elements | — | 255,000 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Maximum Fabric Frequency | — | 500 MHz |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |